Thanks NI3NOR for the heads up on the following report, posted in Neowins own member submitted Back Page News.
Intel is going to implement 2 new sockets for the next generation Nehalem architecture in 2008 and they are Socket B and Socket H. As we know, Nehalem is 45nm based and we are going to see some exciting changes such as IMC (Integrated Memory Controller) and CSI.
Socket B will be LGA1366 and Socket H will be LGA715. The reason why Socket B has so many more contact pads is pretty obvious. It is due to the IMC on the Nehalem CPU. Since there is a Socket H version as well, we can expect there will be another Nehalem based CPUs without IMC.
News source: VR-Zone
Intel is going to implement 2 new sockets for the next generation Nehalem architecture in 2008 and they are Socket B and Socket H. As we know, Nehalem is 45nm based and we are going to see some exciting changes such as IMC (Integrated Memory Controller) and CSI.
Socket B will be LGA1366 and Socket H will be LGA715. The reason why Socket B has so many more contact pads is pretty obvious. It is due to the IMC on the Nehalem CPU. Since there is a Socket H version as well, we can expect there will be another Nehalem based CPUs without IMC.
News source: VR-Zone
Intel will change of micro-architecture to every 2 years, Plus a refresh of the architecture with a die-shrink between both. This give us 1 new series of CPU each year.
If you always wait to upgrading you will wait pretty long time you know?
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