AMD and Intel kiss and make up on next-gen I/O

AMD"s next-generation PC I/O technology, HyperTransport, will almost certainly become a part of Intel"s next-generation PC I/O technology, 3GIO, just as we predicted it would. Staffers at both companies have said they are indeed working to bring the two, rival specifications together, EBN reports today. As we reported yesterday, AMD is now a member of the Arapahoe Work Group, the consortium of companies working to define the 3GIO spec. And, as a member of the PCI Special Interest Group, AMD earlier this month voted that the body should accept 3GIO as the heir apparent to PCI and PCI-X. Intel, meanwhile, appears to be holding out an olive branch. "We now want to make sure both interoperate and work together," said Bob Gregory, director of strategic planning with Intel"s Desktop Products Group, according to EBN.

News source: The Reg

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