Qualcomm will be holding its annual Snapdragon Tech Summit starting on the 3rd of December this year in Maui, Hawaii, where it will most likely announce the next-generation flagship chipset. Dubbed the Snapdragon 865, the SoC (System on Chip) is likely to also come with an integrated 5G modem. In addition to the Geekbench results spotted a few months ago, more details have emerged about the chipset thanks to a recent leak on the Chinese social media platform, Weibo.
The information in the post suggests that the chipset will indeed carry the 865 moniker, in line with the nomenclature followed by the company since the Snapdragon 835. Similar to its predecessor, the Snapdragon 855, the 865 is expected to come in an octa-core flavor that includes one high-performance Cortex-A77 core clocked at 2.84GHz, three Cortex-A77 cores clocked at 2.42GHz, and four power-efficient Cortex-A55 cores clocked at 1.8GHz. In terms of graphic processing, the chipset will sport a 587MHz Adreno 650 GPU, up from the Adreno 640 in its predecessor.
The Snapdragon 865 is expected to be 20% faster than the 855, brought mostly due to the upgraded cores based on the Cortex-A77, which promises a 20% IPC improvement. The Adreno 650 is also expected to be about 20% faster.
Earlier reports also suggest that the next-generation chipset from Qualcomm will come in two flavors, codenamed Kona and Huracan – one of which will house an integrated Snapdragon X55 modem. The X55 brings with it impressive download speeds of up to 7Gbps. Unlike the current crop of 5G capable handsets, devices running the X55 will not need to separately house 4G and 5G modems.
Source: Weibo (Chinese) via Gizmochina