Samsung yesterday unveiled a 1Gb DDR SDRAM chip that beats the size problems common in parts of that capacity by combining two 512Mb dies in a single package. The chip should pave the way for much less expensive high capacity DDR DIMMs for notebook PCs, PDAs and blade servers.
The two dies are stacked vertically yielding a chip footprint of 11.5 x 12mm - the same as a standard Samsung 512Mb part. The new chip is compatible with JEDEC DDR pin standards, allowing manufacturers to simply replace 512Mb chips with the 1Gb part. The chip is available in DDR 266 and 333 versions, Samsung said. It plans to scale the technique to combine two 1Gb dies into a 2Gb chip.