Xbox One Teardown


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I don't know what the XB1's T&Cs are, the Xbox 360 having that makes sense though because they sell you HDDs, much rather you actually buy their drive than make your own.    Are they the same T&C?  When you get yours I suppose you can check.

 

I believe so. I'll take a look and report back if someone else doesn't do it before me.

 

But my advice is for anyone thinking this is an easy upgrade, not to rush out and do it.

no. the xclamp like I said has nothing to do with it. the homebrew screws allow more flattening of the board so it isn't as warped anymore, [snip]

Um yeah, and what do you think caused the warping in the first place?  I explained it pretty clearly for you.  The flimsy x-clamp can't possibly guarantee even pressure, and guess what happens to soft solder when pressure is uneven?  With a threaded screw, you can, especially with lock-tite.  Look at the backside of your PC motherboard.  There is no x-clamp there and never has been.  Enough said.

Um yeah, and what do you think caused the warping in the first place?  I explained it pretty clearly for you.  The flimsy x-clamp can't possibly guarantee even pressure, and guess what happens to soft solder when pressure is uneven?  With a threaded screw, you can, especially with lock-tite.  Look at the backside of your PC motherboard.  There is no x-clamp there and never has been.  Enough said.

xbox 360 still uses xclamp(no problems),and so does xbox one. enough said.

Yes, the issue wasn't the x clamps in the 360. The issue was manufacturing defects/build process defects. Just because you could replace the x clamps to fix the issue, doesn't mean they were the root cause of the issue. The "x clamps" or heatsink back plates as they are actually called, are a fairly common design on a lot of computer motherboards as well. You could repair 360s all day and still use the stock back plates if you wanted to. But drilling through to the metal shell and bolting through there worked better on the more fragile 360s.

 

On an on-topic note, these teardowns are getting boring. Everything is integrated into the boards now minus a hard drive and optical drive for the most part. :laugh:

Yes, the issue wasn't the x clamps in the 360. The issue was manufacturing defects/build process defects. Just because you could replace the x clamps to fix the issue, doesn't mean they were the root cause of the issue. The "x clamps" or heatsink back plates as they are actually called, are a fairly common design on a lot of computer motherboards as well. You could repair 360s all day and still use the stock back plates if you wanted to. But drilling through to the metal shell and bolting through there worked better on the more fragile 360s.

 

On an on-topic note, these teardowns are getting boring. Everything is integrated into the boards now minus a hard drive and optical drive for the most part. :laugh:

Those plates on motherboard are for securing the CPU socket.  The heatsink doesn't use anything of that sort.

This looks like a far more premium system compared to the PS4. I just looked at both tear downs and while thew PS4 is smaller it also has a tiny ass fan and heatsink, plus the heatsink isn't even touching the actual CPU/GPU. There is a piece of metal in between. I have seen videos of PS4s overheating and sounding like an old Phat PS3. I really think Sony rushed to be ahead of the Xbox this go around and it does not seem to be paying off. Time will tell but I am confident that the Xbone is the better choice here. Here is the PS4 tear down if you care to look.

 

http://www.ifixit.com/Teardown/PlayStation+4+Teardown/19493

I wonder what the 8GB eMMC is for if the system has a non-removable hard drive.

I think it has been said that it is being used in combination with the hard drive to create a sort of hybrid-like situation (hybrid hdd/ssd). So in theory it would offer the performance benefits of such a drive, like we saw with the ps4 drive replacement tests.

Those plates on motherboard are for securing the CPU socket.  The heatsink doesn't use anything of that sort.

Tell that to my H110i and Coolermaster V8...

It wasn't the x-clamps and never was.

Well I know that, but 8GB isn't gonna give a great performance boost. Not to mention 8GB on hybrid drive will ware out very quickly if used as a cache.

 

Would rather think it would be used for a recovery drive more than anything.

Because flash is faster than an spinning HDD?  .. I'm surprised people had to ask the question. :huh:

Those plates on motherboard are for securing the CPU socket.  The heatsink doesn't use anything of that sort.

 

PC motherboards use a back plate to releave / even the pressure the heatsink makes when it's secured and clamped in place. They have nothing to do with securing the socket.

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Because flash is faster than an spinning HDD?  .. I'm surprised people had to ask the question. :huh:

 

 

In effect, MS has built in a small SSD to provide some boost in performance.

I would liken it to replacing the standard PS4 drive with a hybrid drive.

 

 

Correct, it was so obvious!

 

Except 8GB is small and could wear out quickly if used for that purpose. I can't tell if this eMMC is SLC or MLC flash. They use low capacity SLC flash on hybrid HDDs and it does give it a small boost. 

 

Possible that the OS is stored on there, but eMMC aren't particularly fast. 

 

Either way I'd like to know what it is ACTUALLY used for, not speculation. 

I just noticed something when reading through the teardown info.  Did anyone else see the wireless chip that the X1 is using?

 

According to iFixit its: Marvell Avastar 88W8897

That chip has the following support:

(Via Marvel's own site)

-IEEE 802.11ac (draft) compliant, 2x2 MIMO spatial stream multiplexing with data rates up to MCS9 (866.7 Mbps)

-Bluetooth 4.0 + High Speed (HS), supports Low Energy (LE)

-Near field communication (NFC) connectivity technology, per NFC Forum specification, for short-range, contactless communication

-Wireless Display

So basically, the X1 could indeed support the AC standard. Maybe MS will simply upgrade the drivers to allow it to be used down the line. It also supports Bluetooth, which I had no idea was built in. So there appears to be more built into the hardware than MS is surfacing at the moment, perhaps because drives were not ready. We will see.

I just noticed something when reading through the teardown info.  Did anyone else see the wireless chip that the X1 is using?

 

According to iFixit its: Marvell Avastar 88W8897

That chip has the following support:

(Via Marvel's own site)

-IEEE 802.11ac (draft) compliant, 2x2 MIMO spatial stream multiplexing with data rates up to MCS9 (866.7 Mbps)

-Bluetooth 4.0 + High Speed (HS), supports Low Energy (LE)

-Near field communication (NFC) connectivity technology, per NFC Forum specification, for short-range, contactless communication

-Wireless Display

So basically, the X1 could indeed support the AC standard. Maybe MS will simply upgrade the drivers to allow it to be used down the line. It also supports Bluetooth, which I had no idea was built in. So there appears to be more built into the hardware than MS is surfacing at the moment, perhaps because drives were not ready. We will see.

 

Good catch, would be interesting for a driver update later on to allow for the use of the above. 

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