Intel's Centrino bundle of a chipset, processor, and wireless LAN module for portable computers will be released on March 12, an Intel spokesperson in Europe said Friday.
The Centrino package is designed for mobility, allowing for the design of smaller notebooks that last longer on a single battery charge, according to Intel.
The company also hopes Centrino will boost wireless LAN use. Intel now makes its own modules for 802.11b WLAN, a market dominated by WLAN specialists.
News source: PC World
