Samsung's H-Cube solution to allow efficient integration of 6 HBMs, and lower cost benefit

Samsung has announced that it has partnered with Amkor Technology and developed a new 2.5D packaging solution, Hybrid-Substrate Cube (H-Cube) technology, that has been specifically designed for semiconductors for High Performance Computing (HPC), AI, data center, and network products that demand large-area and high-performance packaging technology.

Senior Vice President and Head of Foundry Market Strategy Team at Samsung Electronics, Moonsoo Kang stated:

H-Cube solution, which is jointly developed with Samsung Electro-Mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies. By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing.

2.5D packaging allows high-bandwidth memory (HBM) or logic chips to be positioned on top of a silicon interposer in a small form factor. The tech giant's H-Cube technology comes with a hybrid substrate integrated with a fine-pitch substrate capable of fine bump connection, along with a High-Density Interconnection (HDI) substrate, to administer large sizes into 2.5D packaging.

The complexity in developing the large-area substrate augments significantly when incorporating more than 6 HBMs that then, leads to mitigated efficiency. Samsung has developed a solution to this problem by implementing a hybrid substrate structure in which easy-to-implement in large-area HDI substrates are overlapped under a high-end fine-pitch substrate.

Samsung has also implemented its propriety signal/power integrity analysis technology that can supply power while curtailing signal distortion or loss when multiple HBMs or logic chips are being stacked to improve the reliability of the H-Cube solution.

The announcement from the company also mentioned, "Looking ahead, in cooperation with its ecosystem partners, Samsung will hold its 3rd Annual ‘Samsung Advanced Foundry Ecosystem (SAFE™) Forum’ virtually on November 17 (PST)." To learn more about the SAFE forum or for pre-registration, head over to the dedicated webpage here.