Huawei has cracked the EUV chip process according to patent filings made by the company in November. Huawei Chairman Eric Xu also declared that the company is now out of crisis mode.
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Intel is the first chip maker that has placed an order for ASML's High-NA Twinscan EXE:5200 scanner that will allow the company to start using its 18A (1.8nm) fabrication tech starting 2025.
Intel has detailed its architecture roadmap up until 2025 and beyond. It features a new node naming strategy, a transistor architecture, and packaging enhancements under the IDM 2.0 model.
SK hynix has announced today its latest 1anm DRAM node, the company's fourth-gen 10nm memory process. The 1anm node is produced utilizing EUV tech and enables faster and more efficient DRAM chips.
Samsung has announced that it's expanding its foundry capacity by opening up a new line in Pyeongtaek, Korea. The hardware produced there will be used for 5G, HPC, and AI solutions.
Samsung has announced that it has shipped a million extreme ultraviolet-based DRAM modules following the completion of customer evaluations. The firm plans to use the EUV process in future products.
Samsung has announced that it has begun the production of its EUV-based 7-nanometer LPP process chips. It brings drastically increased battery life, better performance and improves area efficiency.
7nm EUV production is slated for 2H-2018; 5nm and 4nm nodes are on track for production in 2019 and 2020. 3nm node is being developed using Gate-All-Around Field-Effect Transistor (GAAFET) technology.
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