Samsung has announced its next evolution of GDDR memory in the form of the new GDDR6W technology. The new tech promises close to HBM levels of performance while smaller than traditional GDDR6.
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Intel has unveiled the Intel Max Series product family for high-performance computing (HPC) and artificial intelligence ahead of Supercomputing '22 (SC22) in Dallas happening between November 14-17.
Samsung Electro-Mechanics (SEMCO) and Amkor Technology have partnered to develop a 2.5D Integration 'H-Cube' solution specialized for semiconductors for HPC, AI, data center, and network products.
SK hynix recently updated its website and it appears to have inadvertently leaked some of the details of next-gen 3D stacked HBM3. The new memory will be close to 50% faster than the current HBM2E.
Samsung has introduced its latest processing-in-memory architecture or PIM. According to the firm, this new innovation is able to double the output while also significantly reducing the power draw.
