Intel's 18A process node is progressing well and is on track for a 2025 launch. It will feature RibbonFET and PowerVia technologies, offering significant performance improvements.
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Intel says its new PowerVia backside power delivery technology has been tested and it registered a 5 percent speed boost. That new tech will be inside Intel's upcoming Arrow Lake chips.
Intel has detailed its architecture roadmap up until 2025 and beyond. It features a new node naming strategy, a transistor architecture, and packaging enhancements under the IDM 2.0 model.