Apple reportedly plans to bring in-house Wi-Fi and Bluetooth chips made by TSMC to next year's iPhone 17 series.
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A Foxconn factory in Bangalore allegedly started experimenting with the prototypes and manufacturing processes for next year's iPhone 17.
Apple may bring a change to Face ID in next year's iPhone 17 Pro Max, making the Dynamic Island slimmer.
Reports suggest that next year's iPhone 17 models will continue to use 3nm processors, while 2nm chips will be introduced with 2026 models.
A fresh tip suggests that next year's iPhone 17 Pro Max could feature 12GB of RAM and upgraded cooling technology, equipped to give tough competition to the Samsung Galaxy S25 Ultra.
An old rumor that surfaced in January has popped up again claiming that the iPhone 17 lineup will be equipped with a 24MP selfie camera, doubling the megapixel count compared to the current models.
Taiwan Semiconductor Manufacturing Company has reportedly started trial production of 2nm chips. Apple, its very important customer, is expected to reserve all of the capacity for the iPhone 17 series
Latest reports suggest that next year, Apple could introduce the iPhone 17 Slim, which would bring about one of the biggest redesigns since the iPhone X and could cost more than the Pro Max variant.