Taiwan Semiconductor Manufacturing Company (TSMC) will become even more aggressive with rolling-out new fabrication processes. The company plans to make 22nm technology available for customers in 2011, whereas the 15nm fabrication process will go online in 2013. However, since those technologies are pretty expensive to develop, larger wafers may be needed to make them feasible.
"While Moore's Law still applies, the shrinking of technology nodes will have to overcome the barriers of power consumption and costs," commented company vice president for research and development Jack Sun, reports DigiTimes web-site.
