VIA Technologies said today that its Esther-codenamed processors will be produced at IBM's 12-inch East Fishkill, New York fab using 90nm SOI CMOS, low-k dielectric manufacturing technologies.
Taiwan Semiconductor Manufacturing Company (TSMC) will continue to produce VIA's existing processor lines as well core logic chipsets, advanced communications, networking and multimedia chip solutions, the chipset vendor said. VIA expects to launch the Esther processors in the second half of this year.
News source: DigiTimes
